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PCB Field Machines

PCB Field Machines

Auto Peeler(DXD200/DXD300)

Specifications

  • Size : 2100mm(W) X 6770mm(L) X 2750mm(H) (DXD200)
    2300mm(W) X 7100mm(L) X 2900mm(H) (DXD300)
  • Product Size : 415mm(W) X 510mm(L) (DXD200)
    510mm(W) X 610mm(L) (DXD300)
  • Application Product : PKG-ABF,DFSR(FCCSP,FCBGA,UTCSP,CSP..)

Special Features

  • Automatic loader/unloader & In line system
  • Both sides vertical auto peeler system
  • Clean system : hepa filter, Ionizer, recycle film system
  • Detachment detection system
  • Pre-align system

Carrier Copper Foil Detach Machine

Specifications

  • Size : 2100mm(W) X 5720mm(L) X 2760mm(H) (DCDS200)
    2300mm(W) X 5920mm(L) X 2860mm(H) (DCDS300)
  • Product Size : 415mm(W) X 510mm(L) (DXD200)
    510mm(W) X 610mm(L) (DXD300)
  • Product Thickness : Carrier Foil(12/12,18/18), Core(0.03~0.4mm)
  • Application Product : HDI, PKG(FCCSP,FCBGA,UTCSP,CSP..)

Special Features

  • Vertical Carrier Automatic Detach System
  • Automatic Loader/Unloader
  • Vision Inspection
  • Detach OK/NG System

Panel Separator(Detach)

Specifications

  • Size : 1650mm(W) X 7740mm(L) X 2150mm(H) (DPSD200)
    1750mm(W) X 8820mm(L) X 2350mm(H) (DPSD300)
  • Product Size : 415mm(W) X 510mm(L) (DPSD200)
    510mm(W) X 610mm(L) (DPSD300)
  • Product Thickness : 0.04~0.35mm(Core 50~100um)
  • Application Product : PKG(FCCSP,FCBGA,UTCSP,CSP..)

Special Features

  • 3 Layer Automatic Separator
  • Automatic loader/unloader
  • Panel warpage bending system
  • Separator OK/NG system

Cure & Unloader(DMTL200)

Specifications

  • Size : 1275mm(W) X 1700mm(L) X 1640mm(H)
  • Product Size : 60~150(W) X 130~230(L) ± 2mm
  • Application Product : ISM(Camera Module)

Special Features

  • Strip Camera Module
  • Magazine Loader/Unloader
  • 5 rows Heater Zone
  • epoxy thermal hardening after die bonder

DCF Attach Machine(DDCFA100)

Specifications

  • Size : 2500mm(W) X 3500mm(L) X 2150mm(H) (DDCFA100)
  • Product Size : 510/610mm(W) X 510~650mm(L)
  • Product Thickness : 0.05~0.1mm
  • Tape Thickness : 190um)
  • Application Product : HDI(Analyzer, Phone Mobile)

Special Features

  • Automatic loader/unloader
  • CCL Insert(A,B)
  • Tape roll to roll insert
  • Attach Lamination
  • Auto Sheet Cutting

DCF Separator Machine(DDCFS100)

Specifications

  • Size : 2500mm(W) X 3500mm(L) X 2150mm(H)
  • Product Size : 10/610mm(W) X 510~650mm(L)
  • Product Thickness : 0.05~0.1mm
  • Application Product : HDI(Any Layer, Phone Mobile)

Special Features

  • Automatic loader/unloader
  • Top, Bottom separate UN unit
  • Recycle tape box cart